Lam Research has announced a job notification for the post of  Mechanical Designer. A student from Any discipline can apply for Lam Research Recruitment 2023. Interested and eligible candidates can read more details below and can apply for Honeywell.

Lam Research Recruitment 2023:

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Job Description:

Lam Research is hiring candidates for the post of Mechanical Designer.

Job Responsibilities:

• Create CAD Model for the design concepts and Implement design changes for parts/assemblies. Support on design of Mechanical components and sub-systems
• Analyze design for manufacturability
• Select OEM parts per design requirements from Engineers and adheres to established processes/Best practices.
• Create, Validate & release of Engineering drawing, relevant procedures and specifications .
  Collaborate with cross-functional teams for release processes
• Provide engineering solutions to simple/medium complex Engineering/Obsolescence issues.
• Participate actively in process improvements to enhance productivity and improve quality.
• Understand Lam products, Business processes and Standards.

Eligibility Criteria:

• A B.E. / B. Tech in Mechanical/ Industrial Production with minimum 65% aggregate
• Graduating in 2023 without any backlogs

Preferred skill:

• 3D CAD Modelling, Part/Assembly using any CAD package.
• Machining, welding, molding, sheet-metal fabrication & casting processes.
• Basic knowledge of Fits, Dimensioning and Tolerances and its application in drawings.
  Engineering drawing fundamentals.
• Mechanical Engineering fundamentals.
• Advanced manufacturing methods – Additive Manufacturing and 3D printing, Water jet machining, Ceramic manufacturing.
• Engineering/design methods & processes.
• Various materials and their applications.
• Hands-on projects that include prototyping and assembly.

About Lam Research :

Lam Research Corporation is an American supplier of wafer fabrication equipment and related services to the semiconductor industry.[2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).